(2nd LD) Samsung's HBM4 sales top US$1 bln 4 months after launch - Yonhap News Agency

Samsung Electronics' sixth-generation high bandwidth memory (HBM4) chips have surpassed $1 billion in sales just four months after launch, signaling strong market demand and growth potential. As the w... Read original →

Samsung’s $1B HBM4 sales in four months reflect not just technical leadership but a strategic capture of AI compute bottlenecks. This triggers upstream pressure on TSMC to accelerate CoWoS upgrades for HBM4 compatibility and forces SK Hynix and Micron to revise HBM3E inventory tactics. U.S. export controls on advanced packaging tools may raise Samsung’s overseas capex, yet reinforce its Korea-centric supply chain resilience. In response, SK Hynix will likely double down on AMD MI300X and Taiwan, China clients, while Micron bets on HBM4P by 2027. Over the next 18 months, HBM4 will cascade from training to inference workloads, reshaping the ecosystem around interposers, TSVs, and memory interface chips—establishing bandwidth as the new valuation axis in semiconductors.