Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit - PR Newswire

On June 16, 2026, Israeli semiconductor company Valens Semiconductor (NYSE: VLN) announced that its HDBaseT chipsets will be integrated into Barco's ClickShare USB-C over CAT kit. This collaboration h... Read original →

Valens’ integration into Barco’s ClickShare signals a strategic pivot in Pro AV: from 'wireless-first' to 'wired-enhanced' architectures. Technically, HDBaseT’s ability to deliver uncompressed 4K and USB2 over 40m directly erodes the mid-range foothold of SDVoE and DisplayPort-over-CATx solutions, pressuring upstream PHY vendors to co-integrate SerDes with power delivery. Regulatory-wise, the EU’s upcoming Digital Product Act raises interoperability and efficiency bars—Valens benefits from its MIPI A-PHY leadership but faces supply chain scrutiny due to its Israel-based fab ties. Competitors like Extron will likely accelerate in-house codec IP development to reduce chipset dependency. Within 18 months, hybrid topologies—wireless endpoints backed by wired backbones—will dominate enterprise meeting rooms, pushing HDBaseT’s Pro AV penetration beyond 35% and forcing USB-IF to fast-track long-reach USB-C standards.