Hanmi Semiconductor expands AI packaging lineup with 2.5D TC Bonder 40 - CHOSUNBIZ - Chosunbiz

Hanmi Semiconductor announced the launch of its new 2.5D TC Bonder 40 equipment on June 30, 2026, aimed at supporting advanced packaging processes for AI system semiconductors. Designed specifically f... Read original →

Hanmi Semiconductor’s 2.5D TC Bonder 40 isn’t just another tool—it’s a strategic wedge into TSMC’s CoWoS bottleneck. By supporting die sizes from 3mm to 40mm with fluxless bonding and auto-conversion, it directly addresses yield loss in HBM-logic integration for NVIDIA’s Blackwell and AMD’s MI300 chips. This move pressures ASM Pacific and K&S to fast-track competing platforms. Geopolitically, Hanmi USA positions the firm inside U.S. AI manufacturing hubs in Arizona and Texas, aligning with onshoring mandates while sidestepping export controls. Over the next 18 months, as Intel’s EMIB battles TSMC’s SoIC, bonders capable of multi-process compatibility will become critical leverage for foundries. If Hanmi successfully transfers its HBM bonder dominance into 2.5D packaging, it could redraw the advanced packaging equipment map.