6G base stations to become AI computing nodes, boosting advanced packaging demand

The evolution of 6G base stations into AI compute nodes blurs the line between telecom infrastructure and distributed computing. Technically, this mandates tight integration of RF front-ends, baseband processors, and AI accelerators—making advanced packaging (e.g., CoWoS, FOPLP) essential rather than optional, intensifying capacity competition among Taiwan, China and South Korea. On compliance, U.S. export controls now cover 2.5D/3D integration tools, exposing Chinese firms to supply chain fragility without rapid domestic substitution. Strategically, Ericsson and Nokia may lock in NVIDIA’s ecosystem via AI-native RAN, while Huawei leverages its Ascend AI chips and in-house RF to close the loop; Qualcomm must accelerate RAN-AI SoC development to retain relevance. Within 18 months, advanced packaging capacity will become the critical bottleneck in 6G prototyping, granting pricing power to OSATs with heterogeneous integration capabilities—while legacy packagers face obsolescence.