AI Data Center Boom Drives Sharp Surge in Power Semiconductors - 36Kr

The rapid expansion of AI data centers is driving a significant surge in the power semiconductor market. Market research indicates that the global power semiconductor market is projected to grow from ... Read original →

The AI data center boom is triggering a cascade of power architecture innovations, forcing a fundamental shift beyond traditional silicon. While TSMC (Taiwan, China) leverages advanced packaging to co-integrate VRMs with GPUs under NVIDIA’s MGX framework, the real bottleneck lies in wide-bandgap adoption: SiC and GaN are no longer optional but mandatory for 800V HVDC and SST implementations. Legacy MOSFET suppliers risk obsolescence unless they embed SiC/GaN into novel topologies like IBC or SSCB. South Korea’s $329M subsidy reveals acute supply chain vulnerability amid U.S. CHIPS Act spillovers. Within 18 months, NVIDIA’s emerging power standards could lock PSU vendors into long-term SiC wafer commitments. A critical choke point remains—GaN epitaxy relies heavily on MOCVD tools dominated by U.S., Japanese, and European firms, with Chinese domestic sourcing below 20%, posing tangible supply continuity risks.