AI demand drives Samsung’s HBM expansion - Borneo Bulletin

The rapid advancement of artificial intelligence technology and the surge in computing demand are driving a new wave of technological upgrades across the global semiconductor industry. Samsung Electro... Read original →

Samsung's HBM capacity push is a strategic bet on AI’s architectural shift, not mere volume scaling. Technically, HBM3E and upcoming HBM4 will accelerate adoption of TSV and hybrid bonding, elevating barriers for equipment makers like ASM Pacific and material suppliers such as Shin-Etsu. Geopolitically, U.S. AI chip export controls to China are inflating global supply chain redundancy costs; Samsung must diversify between Korea and Xi’an, China, to mitigate disruption risks. Under pressure from SK hynix’s HBM market lead, Samsung aims to overtake via scale, while Micron may pivot to CoWoS-L alternatives. Within 18 months, HBM will transition from premium option to AI-chip standard, igniting a per-GB bandwidth cost war and catalyzing real-world adoption of chiplet-based near-memory computing.