Industry Analysis
The AI server surge is triggering a deep-stack reshaping of memory technology: surging HBM demand is accelerating DRAM scaling to 1β and even 1γ nodes, while straining CoWoS advanced packaging capacity and inflating GPU BOM costs. Geopolitically, U.S.-South Korea export controls have forced SK hynix and Samsung to reconfigure production in Taiwan, China and mainland China, making long-term agreements (LTAs) essential for customer lock-in and regulatory risk mitigation. Strategically, SK hynix’s pivot to commodity DRAM reflects capacity rebalancing, whereas Samsung leverages HBM3E yield leadership to capture NVIDIA and Microsoft orders; SanDisk targets inference workloads via enterprise SSDs. Over the next 12–24 months, even if prices correct in late 2027, AI inference’s edge migration will spawn low-power HBM variants—creating a second growth wave. The ultimate winners will be vertically integrated players commanding process, packaging, and custom IP simultaneously.
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