Aletheia Warns HBM Prices Will Double in 2027 as Memory Becomes AI’s Most Critical Component - Wccftech

Financial firm Aletheia Capital predicts that memory chips will become the most critical component in the AI ecosystem, driving significant price increases for HBM and DRAM through 2027. The firm beli... Read original →

Soaring HBM prices signal a fundamental shift in AI hardware architecture: memory is no longer peripheral but the core bottleneck. Technically, designs like NVIDIA’s Vera CPU demand unprecedented memory density, forcing rapid scaling of TSV and CoWoS packaging—driving up costs for advanced packaging tools and materials. On the compliance front, U.S.-led export controls on lithography and deposition tools have materially delayed Samsung and SK hynix’s China-based capacity expansions, tightening global supply elasticity. In strategic response, Micron leverages CHIPS Act subsidies to accelerate HBM4 development and challenge Korean dominance, while Samsung bets on 3D-stacked DRAM to bypass equipment constraints. Over the next 18 months, persistent HBM shortages will accelerate commercialization of CPO and near-memory computing, compelling hyperscalers to revise AI cluster TCO models—where memory may soon eclipse GPU cost, permanently reshaping semiconductor value chains.