Industry Analysis
The Korean market selloff has laid bare the AI chip sector’s acute dependency on HBM memory. While AMD and Intel advance 3nm logic nodes with EUV, their AI accelerators remain bottlenecked by SK Hynix and Samsung’s HBM3E ramp—creating a ‘leading-edge front-end, constrained back-end’ imbalance. Geopolitical friction is inflating inventory buffers, pushing U.S. firms to accelerate alternatives like Japan’s Rapidus, though meaningful capacity won’t materialize before late 2026. NVIDIA may lock in long-term HBM contracts to secure supply, while AMD leverages MI300X momentum to deepen TSMC CoWoS-HBM co-optimization. This correction reflects a necessary recalibration of AI valuations that had far outpaced actual deployment curves. Over the next 18 months, vertically integrated players will dominate AI infrastructure; those reliant on external memory ecosystems face margin erosion and delivery volatility.
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