Industry Analysis
Apple’s price hike stems not from tariffs but from memory scarcity driven by AI data centers’ insatiable demand for HBM, which is cannibalizing standard DRAM/NAND supply. Technically, foundries like TSMC are reallocating advanced packaging capacity to HBM3e/HBM4, inflating BOM costs for consumer devices. Geopolitically, U.S. export controls are fragmenting the memory supply chain, forcing firms into costly multi-sourcing and buffer stocking. Samsung may revive tacit pricing coordination, while SK Hynix accelerates capacity shifts to Taiwan, China to mitigate risk. Over the next 12–24 months, a de facto 'AI-first' allocation model will entrench Micron’s dominance—bolstered by CHIPS Act subsidies and HBM leadership—while eroding OEMs’ cost control, signaling a structural power shift toward upstream memory makers in the semiconductor value chain.
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