As AI pushes data centres to breaking point, some Chinese chipmakers bet on SiC - South China Morning Post

As the global AI boom intensifies pressure on data center power grids, Chinese chipmakers are turning to silicon carbide (SiC) semiconductors to address energy efficiency challenges. Basic Semiconduct... Read original →

The AI-driven power crunch is forcing data centers to overhaul their electrical architectures, propelling silicon carbide (SiC) from EVs into 800V rack-level systems. This triggers a cascade: upstream wafer sizes shift toward 8-inch, while downstream packaging must handle higher switching frequencies and thermal loads. Chinese IDMs like Basic Semiconductor, despite vertical integration, lag global leaders by two technology generations in epitaxial yield and gate oxide reliability. EU policies favoring local suppliers under the Net-Zero Industry Act further raise compliance barriers. As Infineon and Wolfspeed leverage automotive-grade scale to cross-sell into AI infrastructure, Chinese firms risk margin erosion through price wars. Within 18 months, only players meeting AEC-Q101 Grade 0 standards will survive NVIDIA’s supply chain cull—rewarding those with full-stack control from substrate to module.