ASE Technology Q2 Revenue Surges Past NT$191 Billion to Record High, Advanced Packaging Momentum Strong - finance.biggo.com

ASE Technology, a leading semiconductor packaging and testing company, delivered exceptional second-quarter results with record revenue figures. The company reported NT$65.78 billion (approximately $2... Read original →

ASE Technology’s record Q2 revenue underscores that advanced packaging has evolved from a back-end process to a critical enabler of AI chip performance. Technically, high-density integration schemes like CoWoS and FOCoS are forcing front-end equipment vendors to accelerate development of lithography and metrology tools tailored for heterogeneous integration, while driving specification upgrades in upstream materials such as ABF substrates and thermal interface compounds. Geopolitically, tightening U.S. export controls compel ASE to dynamically shift capacity between its Taiwan, China and Malaysia sites, raising operational complexity and compliance costs. In response to TSMC’s vertical integration of CoWoS, ASE must deepen chiplet ecosystem partnerships to lock in HPC clients seeking qualified second sources. Over the next 18 months, advanced packaging will transition from optional to essential in AI infrastructure, with its capex share likely surpassing traditional OSAT for the first time—reshaping global semiconductor value distribution.