Industry Analysis
Samsung and SK Hynix’s capex surge is a tactical move in the AI compute arms race, not mere capacity expansion. ASML’s EUV order boom triggers cascading effects: upstream suppliers like Zeiss face capacity bottlenecks, while advanced packaging (e.g., CoWoS) must accelerate to align with sub-3nm output. Geopolitical export controls from the U.S.-Netherlands-Japan alliance force Korean firms to localize support in Taiwan, China and mainland China—but EUV tool bans create a structural dilemma: mature-node fabs in China risk overcapacity without access to leading-edge tools. TSMC will likely lock in ASML’s High-NA EUV slots as countermeasure, while Intel may pressure Washington to fast-track CHIPS Act disbursements. Over the next 18 months, equipment spending will concentrate on EUV and metrology, cementing a winner-takes-all dynamic that squeezes second-tier vendors.
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