Aurona sees strong PCB demand as AI and high-end chip trends lift sales

Aurona's surging orders reflect the inevitable downstream transmission of AI infrastructure build-out. Soaring demand for high-end PCB materials is accelerating upstream innovation in low-loss copper foil and high-frequency resins, while pressuring substrate makers to fast-track ABF alternatives. With tightened U.S.-EU export controls, production hubs in Taiwan, China and Southeast Asia face rising compliance costs, especially on high-speed interconnect materials. Japanese rivals like Panasonic and Korea’s Doosan are locking in capacity via NVIDIA partnerships, while mainland players such as Shengyi Tech leverage domestic substitution to penetrate server supply chains. Over the next 18 months, AI server shipments will grow over 35% CAGR, yet extended material qualification cycles may trigger temporary high-end PCB shortages—establishing a new competitive barrier defined by both technical moats and geopolitical redundancy.