"Breaking Through the Limits of Process Shrinkage" Advanced Packaging Reshapes the Semiconductor Competitive Landscape as TSMC-Led Backend Ecosystem Reorganization Accelerates - economy.ac

As semiconductor process nodes approach physical limits, traditional process scaling strategies face severe challenges, with advanced packaging technology emerging as a new engine for industry develop... Read original →

As process nodes below 3nm hit quantum tunneling limits, TSMC’s push into advanced packaging represents a systemic response to Moore’s Law exhaustion. Technically, CoWoS and InFO are forcing EDA, substrate materials, and test equipment to evolve—especially accelerating localized supply chains for ABF substrates and silicon interposers. Regulatory pressures from the U.S. CHIPS Act and export controls are inflating cross-border collaboration costs, compelling clients like NVIDIA to embed geopolitical redundancy into packaging design. Samsung and Intel will likely pivot from pure node competition toward Chiplet standardization to circumvent TSMC’s ecosystem lock-in. Within 18 months, advanced packaging capacity—not just wafer fabs—will become the scarcest strategic asset. If Taiwan, China fails to resolve bottlenecks in high-end substrates and thermal interface materials, its manufacturing edge could be undermined by upstream supply constraints.