China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration - digitimes

Chinese advanced packaging provider SJ Semiconductor (SJSemi) has made a significant advancement in 2.5D packaging technology, expanding its silicon-interposer-based platform to 3.3 times the standard... Read original →

SJSemi's breakthrough in 2.5D packaging, achieving a 3.3x standard reticle size, marks a significant leap in China’s advanced packaging capabilities. This advancement directly enables higher integration of AI chips and HBM, crucial for next-gen computing systems. The move pressures upstream suppliers of silicon interposers and equipment to accelerate innovation, while prompting downstream chip designers to reassess packaging strategies. From a compliance standpoint, this development reduces reliance on foreign supply chains, potentially triggering stricter export controls. Global players like ASMC and TSMC may respond with increased investments or partnerships in mainland China. Over the next 12–24 months, packaging will become a core differentiator in AI chip performance, especially in terms of power efficiency and compute density. SJSemi’s innovation could redefine industry benchmarks in advanced integration.