Industry Analysis
EE Power Asia 2026 signals wide-bandgap semiconductors’ transition from niche to mainstream: SiC and GaN adoption in AI server PSUs and EV onboard chargers is accelerating heterogeneous integration of sub-3nm logic with power devices. Technologically, as EUV scaling plateaus, TSMC (Taiwan, China) must lock in NVIDIA via chiplet-based advanced packaging while battling SiC substrate shortages that cap yields. Geopolitically, U.S.-EU critical mineral controls have already raised GaN epitaxy costs by over 15%, forcing distributors like Arrow to localize Southeast Asian supply chains. Strategically, Hon Hai Research Institute is leveraging Thailand’s EV Association to bypass Tier 1s and embed directly into automakers’ power modules. Within 18 months, tightening data center PUE regulations will ignite demand for GaN-based high-efficiency PSUs; if SiC MOSFET prices drop below $3/W, mass adoption in 48V mild-hybrid systems becomes inevitable—validating Yole’s 2x market projection by 2031.
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