Everyone's talking about AI chips. But what makes those chips powerful in the first place? ‘Without advanced packaging, there is no AI,’ says Audrey Charles, SVP, Advanced Packaging & President, Lam Capital. In this episode of Voices From The Valley, Audr - LinkedIn

In the rapidly evolving landscape of artificial intelligence (AI), the performance of AI chips has become a central focus. However, what truly drives their power is not merely the chip's process node,... Read original →

Advanced packaging has shifted from a supporting role to the frontline of AI chip performance competition. Lam Capital’s assertion that 'without advanced packaging, there is no AI' underscores how system-level integration—not just transistor scaling—now drives computational leaps beyond the 3nm node. Technically, panel-level packaging will accelerate tighter HBM-logic die stacking, forcing upgrades across EDA, thermal interface materials, and test infrastructure. On the compliance front, U.S. and EU subsidies for domestic packaging capacity, combined with tightening export controls, will inflate costs and lead times for smaller firms seeking CoWoS-like solutions. Strategically, TSMC (Taiwan, China) leverages SoIC and InFO as moats, while Intel and Samsung will likely open up Foveros and I-Cube ecosystems to win design wins. Within 18 months, packaging prowess will dictate datacenter AI cluster efficiency and density—chip designers lacking heterogeneous integration capabilities risk obsolescence.