Global Semiconductor Packaging Market to Exceed $618 Billion in 2026, KPCA Says - thelec.net

KPCA's latest report forecasts the global semiconductor packaging market to exceed $618 billion by 2026, reflecting sustained industry growth driven by increasing demand for high-performance chips in ... Read original →

KPCA’s forecast of a $618B semiconductor packaging market by 2026 underscores a structural shift driven by AI and high-performance computing. Surging demand for OLED displays in premium smartphones like the iPhone 18 Pro, coupled with DRAM prices potentially rising 48% in Q2, is accelerating adoption of advanced packaging. SK hynix’s hybrid bonding breakthroughs in HBM enhance yield and reinforce its AI memory dominance, while Samsung’s dual focus on HBM4 and silicon photonics signals a strategic pivot to revive its foundry business. Qualcomm’s entry into data-center chips and Tencent’s Hy3 AI model highlight intensifying global competition beyond hardware—extending to system-level integration. Notably, Apple’s exploration of alternative foundries like Samsung and Intel reflects a broader supply chain diversification away from TSMC dependency. This shift not only heightens foundry rivalry but also elevates packaging from a back-end process to a critical performance and cost differentiator, positioning it at the heart of next-gen semiconductor innovation.