Google's Samsung Talks Highlight TSMC Capacity Crunch - TradingView

Recent reports indicate that Google is in talks with Samsung to produce memory input-output dies for a future TPU chip, highlighting the severe capacity constraints at TSMC. While TSMC remains the pri... Read original →

Google’s move to engage Samsung for TPU I/O dies reveals TSMC’s 1.4nm capacity in Taiwan, China is hitting hard physical limits. This triggers a technical cascade: intensified EUV tool competition will accelerate chiplet-based co-design between HBM and logic dies. On compliance, tighter U.S. export controls on advanced lithography equipment heighten supply chain fragility—Samsung’s yield volatility could become a critical risk. Strategically, NVIDIA may fast-track Intel Foundry collaboration on 3D packaging to reduce TSMC dependency. Over the next 12–24 months, hyperscalers will institutionalize dual-sourcing manufacturing, granting Samsung, Intel, and even SMIC strategic footholds in non-core modules—but systemic bottlenecks in leading-edge capacity will continue to throttle AI infrastructure scaling.