Govt bets on five local semiconductor companies capturing 7% of global advanced packaging market by 2035 - KLSE Screener

The Malaysian government has allocated RM185.8 million in R&D funding to five local semiconductor companies forming the Malaysia Advanced Packaging Consortium (MAPC), aiming to capture 7% of the globa... Read original →

Malaysia’s advanced packaging push is a strategic play to capture value from the AI-driven semiconductor arms race. Technically, surging demand for HBM and 2.5D/3D chiplets will force local firms like Inari and Pentamaster to vertically integrate into EDA, mid-end inspection, and ultra-pure materials. Government R&D grants lower innovation risk, but without JEDEC or SEMI certification, these firms remain supply chain outsiders. Regionally, Taiwanese OSAT giants may accelerate India/Vietnam expansions to neutralize Malaysia’s geopolitical premium, while Singapore doubles down on IP and design services. Within 18 months, MAPC’s success hinges on securing design-in slots with NVIDIA or AMD—if achieved, it triggers a virtuous cycle of validation, volume orders, and talent repatriation; if not, it stalls as another low-tier packaging hub.