Gudeng sees double-digit advanced packaging growth from 2027

Gudeng's projected double-digit advanced packaging growth signals a robust demand pull from AI and HPC, accelerating capacity expansion in the sector. This trend will pressure upstream foundries to enhance EUV and TSV capabilities, while driving downstream test and materials vendors into new investment cycles. From a geopolitical standpoint, increasing tech decoupling between China and the US raises compliance costs and supply chain risks. Competitors may respond by accelerating local production lines to mitigate trade constraints. Over the next 12 to 24 months, packaging will increasingly integrate with chip design, forming a new paradigm where 'packaging becomes design.' This evolution marks a fundamental reshaping of the global semiconductor ecosystem.