Hanwha's PLUS Global HBM Semiconductor ETF Hits 2 Trillion Won in a Month - Seoul Economic Daily

Hanwha PLUS Global HBM Semiconductor ETF reached a milestone of 2 trillion KRW within a month, highlighting strong market interest and investment enthusiasm in high-bandwidth memory (HBM) semiconducto... Read original →

The $1.5B inflow into Hanwha’s HBM ETF within a month signals capital shifting from broad semiconductor exposure to targeted bets on AI memory bottlenecks. Technically, HBM3E/HBM4 ramp-up will force TSV and hybrid bonding capacity expansion, benefiting OSATs in Taiwan, China and Korea, while accelerating alternatives like silicon photonics and CoWoS substitutes. On compliance, although U.S. HBM export controls remain pending, Samsung and SK Hynix are already diversifying production geographies—adding 10–15% to operational costs. In response, TSMC may accelerate HBM packaging ecosystem integration, while Micron could deepen NVIDIA ties to anchor North American supply chains. Over the next 18 months, HBM financialization will forge a tech-finance feedback loop: ETF proceeds will fund equipment and materials innovation, shifting the industry from cyclical to technology-premium driven—marginalizing DRAM players without HBM design wins.