HBM TAM Pulled Into 2027, MLCC Demand to Quadruple by 2030 | WallSt Weekly Insight - Moomoo

Recent insights from Wall Street Weekly highlight a positive outlook for the High Bandwidth Memory (HBM) market, which is expected to see significant growth by 2027, driven by strong demand from artif... Read original →

The acceleration of HBM demand into 2027 reflects AI’s insatiable appetite for bandwidth, directly amplifying reliance on advanced packaging like TSV and RDL at sub-3nm nodes—this in turn spikes high-end MLCC consumption for power integrity and noise filtering. Japanese and Korean firms dominate ultra-miniaturized MLCCs via proprietary ceramic powders and thin-film tech; without rapid co-integration capabilities, packaging players in Taiwan, China and mainland China risk exclusion from HBM3E/4 supply chains. U.S. export controls on advanced packaging tools threaten non-U.S. capacity ramp timelines, inflating compliance costs. Samsung and SK Hynix are securing long-term MLCC deals with Murata and TDK, while Micron leverages CHIPS Act subsidies to build North American alternatives. Within 18 months, MLCCs will shift from commodity components to strategic assets—capacity deployment speed will dictate HBM delivery cadence, opening a decisive window for industry realignment.