Huawei produces 122TB SSDs using proprietary packaging to work around US semiconductor restrictions - TweakTown

Huawei has developed a 122TB solid-state drive (SSD) using its proprietary Die-on-Board chip-packaging technology to circumvent U.S. semiconductor restrictions. This technology enhances storage capaci... Read original →

Huawei’s 122TB SSD leveraging proprietary Die-on-Board (DoB) packaging represents a systemic workaround to U.S. sanctions that bypasses reliance on EUV-based logic nodes. While DoB sacrifices some thermal efficiency and yield, it forces co-design across NAND stacking, controller architecture, and firmware—reshaping the storage tech stack. Compliance-wise, this reduces exposure to advanced-node import bans but raises localized validation costs and risks triggering new U.S. export controls on advanced packaging tools. Competitors like Samsung, Kioxia, and Solidigm will likely accelerate integration of QLC/PLC NAND with CXL memory pooling to defend enterprise margins. Within 18 months, heterogeneous integration approaches like DoB will dominate China’s storage roadmap, shifting global SSD innovation from process-node scaling to packaging-centric density—and redefining data center power-per-terabyte benchmarks.