India’s 2035 Chip Ambitions Focus on Targeted Design, Manufacturing Leadership

In May 2026, India’s policy think tank NITI Aayog released the report 'Future of India’s Semiconductor Industry,' outlining a strategy to build a $120–$150 billion semiconductor value chain by 2035. T... Read original →

India’s 2035 semiconductor roadmap succeeds by leveraging its design talent and materials chemistry base rather than chasing bleeding-edge nodes. By prioritizing mature-node logic, SiC/GaN devices, and TMR-based sensors, it sidesteps EUV export controls while targeting Infineon’s core markets in power electronics. This focus triggers downstream effects: localized RF IoT and memory contention validation will reshape EDA/IP ecosystems, while Tata’s ASML engagement hints at a play for advanced packaging material standards. Geopolitically, India positions itself as a 'trusted alternative' outside U.S.-China decoupling tensions. Within 18 months, TSMC (Taiwan, China) and Malaysian OSATs may accelerate Indian investments to hedge against tariff risks and supply chain fragmentation. Yet without clustered wafer fabs, reliance on design and assembly alone won’t yield systemic resilience.