Intel recruits former SK hynix CEO to oversee advanced packaging - 매일경제

U.S. semiconductor giant Intel has appointed former SK Hynix President Lee Seok-hee as executive vice president of its foundry business, overseeing advanced packaging, system integration, and backend ... Read original →

Intel’s recruitment of ex-SK hynix president Lee Seok-hee signals a strategic pivot toward packaging-led differentiation as transistor scaling stalls. With AI and HPC demanding heterogeneous integration, Lee’s dual expertise in memory systems and Intel’s legacy process tech positions Foundry to accelerate Co-EMIB and Foveros adoption—directly challenging TSMC’s SoIC and Samsung’s I-Cube. Geopolitically, while the U.S. CHIPS Act incentivizes domestic advanced packaging, reliance on Japanese substrates and Korean test infrastructure inflates compliance overhead. Within 12–24 months, foundries mastering chiplet co-packaging will dictate AI accelerator economics, leaving non-integrated players at severe competitive risk.