Kinsus Interconnect Tech outlines its role in advanced packaging. The company positions for long-ter - Ad-hoc-news.de

Kinsus Interconnect Tech, a Taiwan-based company specializing in IC substrates and advanced packaging solutions, plays a critical role in the semiconductor supply chain by bridging chip fabrication an... Read original →

Kinsus, a leading IC substrate maker in Taiwan, China, is shifting advanced packaging from a supporting role to a critical performance bottleneck resolver. As 3nm and below nodes push transistor density via EUV, interconnect latency and thermal issues migrate downstream—making Kinsus’s high-density multilayer substrates and fine-line routing essential for NVIDIA’s next-gen AI chips like GB200. Geopolitically, while the U.S. CHIPS Act incentivizes domestic packaging, it lacks Taiwan’s integrated materials-fabrication ecosystem, raising compliance costs without near-term supply relief. Japanese rivals Ibiden and Shinko are expanding ABF capacity, but Kinsus’s deep co-optimization with TSMC’s CoWoS lines secures yield and delivery advantages. Over the next 18 months, surging AI cluster demands for bandwidth and thermal control will keep high-end substrate capacity tight, enabling Kinsus to command pricing power beyond cyclical swings.