Lam Research (LRCX) Is Betting On Advanced Packaging For 50% Growth In 2026 - Yahoo Finance

Lam Research (LRCX) is positioning advanced packaging as a key growth pillar, projecting over 50% revenue growth in this segment by 2026. This strategic shift aligns with rising demand for AI chips, h... Read original →

Lam Research’s aggressive push into advanced packaging reflects a strategic bet on the architectural shift toward chiplets and HBM-driven AI accelerators. This transition elevates packaging from a back-end afterthought to a critical performance enabler, directly boosting demand for electroplating, temporary bonding, and hybrid bonding tools—blurring traditional front-end/back-end equipment boundaries. Geopolitical pressures are accelerating TSMC (Taiwan, China), Samsung, and SK Hynix fab expansions in the U.S. and Japan, forcing equipment vendors to localize support and absorb higher compliance costs. Applied Materials may counter with integrated deposition-metrology platforms, while KLA leverages inspection expertise to dominate CoWoS yield control. Over the next 18 months, advanced packaging tool orders will signal capex momentum; Lam’s 50% growth target hinges on securing slots in TSMC’s and Micron’s next-gen InFO/FOVEROS lines—if not, the projection risks significant slippage.