LPK: Leadership in advanced packaging and LIDE technology drives growth amid ongoing restructuring - TradingView

Despite a challenging Q1 2026, LPK (LPKF Laser & Electronics SE) demonstrated strong leadership in advanced packaging and leveraged its LIDE technology to drive growth. LIDE enables defect-free glass ... Read original →

LPK’s Q1 2026 resilience stems from its LIDE laser technology enabling crack-free glass structuring—critical for 3nm-class advanced packaging and co-packaged optics. This capability exerts upstream influence on substrate suppliers and downstream OSATs by redefining precision interconnect standards. However, tightening EU critical raw materials regulations and U.S. export controls on high-power lasers will inflate compliance costs and jeopardize delivery reliability to customers in Taiwan, China and Hong Kong, China. Competitors like Applied Materials and Canon are rapidly advancing laser-assisted packaging tools, forcing LPK to lock in clients via integrated equipment-process solutions. Over the next 18 months, as chiplet adoption accelerates and perovskite solar scales, LPK’s ability to repurpose LIDE for heterogeneous integration lines could transform it from a niche player into a foundational enabler of next-gen semiconductor manufacturing.