MAHLE develops cooling unit for Infineon power modules used in data centre applications - ET Manufacturing

MAHLE's development of a cooling unit for Infineon's power modules represents a significant advancement in thermal management for data center applications. This collaboration addresses the growing dem... Read original →

MAHLE’s collaboration with Infineon signals a strategic pivot: automotive-grade thermal tech is now being repurposed for data center infrastructure, forcing tighter co-design between power modules and cooling architectures. This convergence pressures upstream chip designers to adopt thermal interface standards and compels downstream rack integrators to rethink liquid-cooling layouts. Amid EU Critical Raw Materials Act and U.S. IRA constraints, such cross-sector integration lowers per-watt cooling costs but heightens exposure to copper and rare-earth supply volatility. Competitors like STMicroelectronics and onsemi will likely accelerate in-house thermal solutions or partner with specialists like CoolIT to stay competitive in high-power SiC/GaN markets. Within 18 months, thermal design will become a core product differentiator—bundling power devices with cooling units will redefine value chains and shift bargaining power between IDMs and Tier 1 suppliers.