Micron (MU) to soar from AI boom as demand outstrips supply - Fox Business

Micron is poised to benefit significantly from the AI boom, as chip demand outpaces supply capacity. According to Mayflower Advisors co-founder Larry Glazer, the rapid advancement of artificial intell... Read original →

Surging AI compute demand is triggering a cascade redesign across the memory stack: HBM3E—and soon HBM4—is becoming mandatory in data centers, compelling Micron to accelerate integration into advanced packaging ecosystems akin to TSMC’s CoWoS. Tightening U.S. export controls, coupled with Japanese and Dutch equipment licensing constraints, have inflated advanced DRAM capex by 15–20%, pushing supply chain resilience to its limits. With Samsung delaying HBM4 volume ramp and SK hynix running at full capacity, Micron—bolstered by exclusive partnerships with North American hyperscalers—is positioned to capture over 30% of the premium HBM market by late 2026. Over the next 18 months, consolidation will intensify: only players mastering TSV and hybrid bonding will survive, while second-tier suppliers lacking AI-optimized memory roadmaps risk permanent exclusion from the high-performance ecosystem.