Micron Stock And 2 AI Chip Picks Backed By Data Center Demand - simplywall.st

In July 2026, the semiconductor and AI industry continues to attract significant market attention, with demand for AI chips at the forefront. Micron Technology, a global leader in memory and storage s... Read original →

The AI data center boom is triggering a deep restructuring of the semiconductor tech stack. Micron’s HBM3E dominance and $100B customer commitments not only dampen memory cyclicality but also force TSMC and Samsung to accelerate CoWoS and TSV packaging capacity, driving Onto Innovation to evolve metrology for hybrid bonding. However, U.S. CHIPS Act ‘guardrails’ inflate GLOBALFOUNDRIES’ compliance costs in New York and Germany, blocking sub-2nm investment and pushing it toward FD-SOI differentiation to avoid direct clashes with TSMC. Over the next 18 months, HBM demand will expand from GPUs to AI inference ASICs, making memory-logic co-design the new battleground. If Micron fails to ramp HBM4 with high yield by 2027, SK Hynix could erode its lead; meanwhile, metrology vendors must embed AI-driven inspection into closed-loop manufacturing—or risk valuation collapse.