Industry Analysis
Micron’s surge stems not just from AI hype but from a technical lock-in between HBM3E and NVIDIA’s Blackwell B200 architecture. Upstream EUV tool delays are pushing Micron and SK Hynix to deepen CoWoS packaging alliances, raising barriers for AMD and Intel in the AI accelerator race. While U.S. CHIPS Act subsidies ease Arizona fab expansion costs, Micron’s $25B capex could collide with rising HBM output from Taiwan, China and mainland China by 2027. SK Hynix has already secured early access to ASML’s High-NA EUV systems—a strategic moat Micron lacks. Over the next 18 months, HBM dynamics will shift from performance scarcity to supply competition. If agentic AI inference demand stalls, a structural glut may hit by 2028, making today’s 81% gross margin guidance unsustainable.
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