Micron Warns Memory Crunch Will Outlast 2026 as AI Demand Outpaces What HBM, DRAM and NAND Can Supply - Wccftech

Micron Technology warns that memory market shortages will persist well beyond 2026, highlighting the growing mismatch between AI demand and current HBM, DRAM, and NAND supply capabilities. This warnin... Read original →

Micron’s warning that memory shortages will extend beyond 2026 reveals a structural rupture: AI’s insatiable bandwidth demands are outpacing Moore’s Law-driven scaling. Technically, HBM4 and high-layer 3D NAND face physical limits, shifting bottlenecks to advanced packaging (e.g., CoWoS) and EDA capacity. Geopolitically, U.S. export controls force supply chain diversification, yet equipment bans constrain DRAM/NAND expansion in Taiwan, China and mainland China, inflating redundancy costs. Competitively, Samsung may rush HBM4 to lock in NVIDIA GB200 sockets, while SK hynix bets on silicon photonics integration—Chinese players like YMTC and CXMT remain hamstrung by IP and tooling gaps. Over the next 12–24 months, memory transitions from a commodity to a system-level design anchor, redirecting capex toward heterogeneous integration and near-memory computing, heralding a strategic reshuffle.