Mizuho says ignore Apple noise, flags key catalyst for Micron and memory in H2 - Investing.com

Micron Technology, as a leading global memory manufacturer, has attracted significant market attention regarding its second-quarter performance. Morgan Stanley's analysis suggests that while Apple's r... Read original →

Micron’s advances in 3D NAND and DRAM are triggering a structural reshuffle across the memory stack. Its near-200-layer NAND reduces controller complexity, pressuring equipment vendors to accelerate EUV adoption beyond logic chips. Geopolitically, U.S. export controls compel Micron to restrict its Xi’an fab to mature nodes, inflating global capacity-allocation costs. With Samsung pushing AI-optimized modules and SK Hynix deepening NVIDIA HBM integration, Micron must differentiate via CXL-enabled DRAM. Over the next 18 months, as memory consumes over 40% of AI server BOMs, LPDDR5X and HBM3e will dominate margins. Failure to achieve >85% HBM yield by 2027 risks marginalizing Micron in the AI-driven memory boom.