Necessity is the Mother of Invention: Huawei Replaces Moore’s Law With Her’s Law

At IEEE ISCAS 2026 in Shanghai, Huawei's president He Tingbo unveiled 'Her’s Law' as China’s response to U.S. chip sanctions, replacing Moore’s Law. With access to EUV technology blocked, Huawei is le... Read original →

Huawei’s ‘Her’s Law’ marks a strategic pivot from transistor scaling to system-level integration via LogicFolding and hybrid bonding, enabling τ-scaling without EUV. This forces China’s domestic EDA, advanced packaging, and test equipment sectors into rapid co-evolution. While SMIC remains capped at ~7nm lithography, it can carve a moat in heterogeneous 3D stacking. The U.S. may soon restrict advanced packaging materials, raising supply chain costs. Meanwhile, TSMC and Intel’s continued bet on GAA and High-NA EUV risks a cost-performance inflection post-2027. Competitors like AMD and Global Unichip might leverage Chiplet alliances but lack Huawei’s vertical integration. Within 18 months, China’s semiconductor ecosystem will coalesce around a unified 3D integration roadmap, spawning new IP and thermal management markets—and cementing a bifurcation in global chip development: density-centric vs. system-centric paradigms.