[News] Samsung May Announce New Gwangju Advanced Packaging Base by End-June as Capacity Expansion Continues - TrendForce

According to multiple Korean media reports, Samsung Electronics is reportedly planning to announce the construction of a new advanced packaging facility in Gwangju by the end of June. This marks the c... Read original →

Samsung’s new advanced packaging facility in Gwangju signals more than geographic diversification—it’s a direct response to the technical bottlenecks of TCB and HCB processes amid escalating HBM demand. This move will pressure upstream equipment makers to accelerate low-warpage substrate and high-precision bonding solutions, while forcing OSATs to leap toward chiplet integration capabilities. Regulatory constraints on water and power in Korea’s capital region are compelling this southward shift, yet the $1.5B Vietnam test facility introduces new export control risks under tightening U.S. tech oversight. If SK hynix follows into the Honam region, competition for scarce packaging engineers in Korea will intensify. Over the next 18 months, while overcapacity remains unlikely, a stark technological bifurcation will emerge: firms mastering hybrid bonding and 3D stacking will dominate AI supply chains, leaving laggards marginalized in high-end markets.