Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes - PR Newswire

On July 2, 2026, Nova (NASDAQ: NVMI) announced that its Nova WMC™ platform has been selected by a leading global foundry customer for multi-layer measurement in the most advanced packaging processes. ... Read original →

TSMC’s adoption of Nova’s WMC™ as the metrology tool-of-record for advanced packaging signals a shift toward nanometer-scale warpage control in 3D integration. Its ability to map asymmetric, highly warped wafers in real time directly alleviates HBM stacking yield bottlenecks, forcing upstream material suppliers to refine temporary bonding formulations and pushing OSATs toward closed-loop process control. Amid U.S.-Netherlands export curbs, Nova’s Israel-based R&D and global service footprint mitigate geopolitical compliance risks—though TSMC’s potential capacity shifts to Arizona could inflate local calibration costs. Competitors like KLA and Hitachi High-Tech lack WMC™’s modular architecture and will likely counter by specializing in TSV sidewall or micro-bump inspection niches. Over the next 18 months, surging demand for CoWoS-R and Foveros will likely propel Nova’s advanced packaging metrology share from ~35% to over 50%, cementing a defensible moat built on integrated equipment-data-process synergy.