Nvidia’s HBM Push Opens Door to $1.52 Trillion Memory Market Next Year - bloomingbit

The global memory market is poised for significant growth driven by the rapid expansion of AI infrastructure, with forecasts projecting the market to reach $1.52 trillion in 2027 from $1.09 trillion i... Read original →

NVIDIA’s aggressive HBM4E adoption is redefining co-design between AI accelerators and memory. Its 3nm platform demands higher EUV layer counts and TSV density, compelling Samsung and SK Hynix to accelerate hybrid bonding—raising DRAM capex barriers and sidelining smaller players. This intensifies supply chain concentration, especially as U.S.-led export controls on lithography tools constrain Taiwan, China and Hong Kong, China’s back-end operations. Samsung may counter with 3D DRAM-on-logic stacking, while SK Hynix doubles down on CoWoS-L integration to lock in NVIDIA dependency. Although aggressive capacity ramps risk a price correction in late 2027, the relentless bandwidth-per-watt demands of AI data centers will sustain HBM’s premium through 2028. Within 18 months, memory vendors lacking advanced packaging capabilities will be purged from the high-end server segment.