Nvidia's Huang to meet Taiwan Semiconductor Manufacturing firm's co-chairman Wei in Taiwan - ET Manufacturing

NVIDIA CEO Jensen Huang's planned meeting with TSMC co-chairman Wei Je-Ren in Taiwan underscores the critical importance of key partnerships within the global semiconductor supply chain. TSMC, as the ... Read original →

Jensen Huang’s in-person meeting with TSMC’s C.C. Wei in Taiwan, China signals that the AI chip race has hit physical scaling limits. With 3nm and upcoming 2nm nodes demanding unprecedented EUV layer counts and yield control, NVIDIA must secure TSMC’s advanced capacity for the next 18 months—or risk a roadmap gap post-Blackwell. This accelerates co-optimization between CoWoS packaging and chip design, forcing EDA and IP vendors to adapt ahead of schedule. Geopolitically, U.S. export controls inflate compliance costs and restrict TSMC’s Nanjing fab expansion, pushing NVIDIA to concentrate orders in Taiwan, China—deepening regional supply concentration. Intel and AMD will likely double down on Samsung’s 3nm GAA, but yield issues delay meaningful substitution. Over the next 24 months, advanced packaging—not just transistor density—will define competitive advantage, and TSMC’s InFO/SoIC stack is transforming manufacturing leadership into ecosystem pricing power.