Planarization Layer Material Market Forecast Points Higher Toward 2035, Driven by EUV Lithography Scaling - IndexBox

According to IndexBox's market analysis report, the planarization layer material market is expected to experience sustained growth in the coming years, primarily driven by the continuous evolution of ... Read original →

As EUV lithography pushes below the 3nm node, planarization layer materials are transitioning from a supporting role to a critical bottleneck. Technically, this forces CMP slurries and spin-on-glass (SOG) to achieve atomic-level surface control, triggering co-optimization across photoresists, masks, and wafer chucks. On compliance, U.S. export controls now extend to advanced materials, prompting Japan and Korea to localize supply chains, while foundries in Taiwan, China and mainland China face dual pressures of indigenization and geopolitical scrutiny. Strategically, incumbents like Entegris, Merck, and Tokyo Ohka will deepen integration with ASML and TSMC to lock in high-end market share, squeezing smaller rivals into niche nodes. Over the next 12–24 months, the long-tail effect will crystallize: yield will be defined not by tools, but by who masters sub-angstrom planarity.