Samsung could become HBM market share leader in 2027 - digitimes

According to DIGITIMES, Samsung Electronics could overtake SK Hynix to become the global leader in the high-bandwidth memory (HBM) market by 2027, driven by competitive advantages of HBM4 technology. ... Read original →

Samsung’s potential HBM leadership by 2027 hinges on its 1c-node DRAM, which uniquely balances HBM4 yield and cost—forcing upstream TSV and micro-bump packaging to accelerate upgrades, while downstream AI accelerators must redesign memory interfaces. Geopolitically, tighter U.S.-led export controls disadvantage SK Hynix’s expansion, whereas Samsung’s vertically integrated Korean supply chain mitigates compliance risk. In response, SK Hynix will likely fast-track HBM4E or even HBM5 roadmaps and deepen co-validation ties with NVIDIA and AMD. Within 18 months, HBM will shift from a premium option to a baseline requirement for AI chips, pulling mid-tier GPUs and edge AI servers into adoption—and widening the performance chasm that could permanently sideline second-tier DRAM makers.