Samsung Focuses on HBM Expansion as AI Demand Reshapes Chip Market - Koreabizwire

As artificial intelligence (AI) demand surges, the global semiconductor market is undergoing significant transformation, with high-bandwidth memory (HBM) emerging as a key growth area. Samsung Electro... Read original →

Samsung’s aggressive HBM4 ramp-up and long-term deals with NVIDIA and AMD signal that memory is no longer a commodity but a strategic bottleneck in AI infrastructure. Technologically, soaring HBM demand intensifies co-optimization pressure between 3nm logic dies and EUV-based TSV stacking, raising barriers for smaller players. Geopolitically, U.S. export controls compel Samsung to shift capacity to Korea and Texas, inflating CapEx while securing supply chain resilience. With SK hynix leading in HBM3E share, Samsung’s ‘sample-first, contract-lock’ tactic targets the 2026 HBM4 inflection point to reclaim market leadership. Over the next 18 months, HBM will evolve from a memory product into a performance-defining lever: control over HBM supply cadence equates to control over AI cluster deployment timelines for hyperscalers and chipmakers alike.