Samsung Ready To Tackle Intel & TSMC With Its 1.4nm Process Tech, Aiming Mass Production For 2029 - Wccftech

Samsung Electronics is preparing to enter the competitive landscape of 1.4nm process technology, aiming to challenge both Intel and TSMC. While both Intel and TSMC are advancing their own 1.4nm nodes,... Read original →

Samsung’s delay of its 1.4nm node to 2029 is a tactical retreat—prioritizing yield stability at SF2 to avoid repeating the 3nm GAA yield disaster. This forces equipment vendors like Applied Materials and Lam Research to accelerate high-NA EUV-compatible etch and deposition tools, lifting upstream material purity and metrology standards. Geopolitically, U.S. CHIPS Act subsidies tied to domestic fabs expose Samsung to scrutiny over tech leakage and inflated CapEx if it builds 1.4nm lines in America. TSMC, despite skipping high-NA EUV, leverages dense multi-patterning on A16 to deliver equivalent scaling with trusted reliability, while Intel’s 18A-P risk production may lure AMD or Qualcomm—eroding Samsung’s foundry exclusivity hopes. Over the next 18 months, Samsung must prove SF2P’s cost efficiency or risk marginalization in the AI chip foundry race.