Samsung targets Nvidia and Google with new long-term HBM deals - Latest news from Azerbaijan

Samsung is expanding its market share in high-performance memory chips by establishing long-term HBM (High Bandwidth Memory) partnerships with industry leaders like NVIDIA and Google, reinforcing its ... Read original →

Samsung’s long-term HBM deals with NVIDIA and Google signal a new era of vertically integrated AI memory supply chains. Technically, this accelerates adoption of CoWoS-like advanced packaging for HBM3E/HBM4, pressuring TSMC and SK hynix to refine TSV and hybrid bonding processes. From a compliance standpoint, U.S. export controls on AI chips are spilling into memory; Samsung leverages Western contracts to mitigate geopolitical exposure but risks over-concentration in North America, limiting flexibility in markets like Taiwan, China and South Korea. Competitively, SK hynix—though still HBM market leader—is losing premium share to Samsung’s 1β-node and silicon interposer integration, while Micron lags in volume ramp. Over the next 12–24 months, HBM capacity will dictate AI compute pricing power, with hyperscalers likely locking in supply via prepayments, cementing a winner-takes-most dynamic.