SEMI Summit spotlights Europe’s chiplet and packaging push ... - eeNews Europe

At the SEMI 3D & Systems Summit, which will be held in Dresden, Germany from June 17-19, 2026, Europe’s semiconductor industry will highlight its advancements in advanced packaging and heterogeneous i... Read original →

Europe’s strategic focus on chiplets and heterogeneous integration at the SEMI Summit reveals a calculated pivot to bypass advanced-node restrictions. Technically, this accelerates demand for 3D packaging tools, silicon interposers, and thermal solutions, forcing local supply chains to shift from pure manufacturing to system-level integration. Regulatory risks loom: while the EU Chips Act eases capex burdens, U.S.-Dutch export controls on advanced packaging equipment could constrain access to critical tools. With TSMC’s CoWoS capacity stretched and Intel aggressively licensing EMIB, European IDMs must close the design-packaging-test loop within 18 months—or risk marginalization in AI hardware ecosystems. Over the next 24 months, packaging will become the new geopolitical battleground: control over heterogeneous integration standards equals architectural authority over next-gen AI chips.