Seok-Hee Lee appointed Intel EVP to lead advanced packaging - eciks.org

On June 18, 2026, Intel appointed Seok-Hee Lee as Executive Vice President of Intel Foundry, tasked with leading the company's advanced packaging, system integration, and backend manufacturing operati... Read original →

Intel’s appointment of Seok-Hee Lee to lead advanced packaging is a strategic pivot to overcome AI chip scaling limits as Moore’s Law stalls. Packaging has evolved from a backend afterthought into the linchpin of system-level performance—triggering cascading investments in hybrid bonding, silicon photonics, and Chiplet ecosystems while forcing EDA vendors to overhaul design flows. Under U.S. CHIPS Act pressures, Intel must differentiate its domestic packaging capacity from TSMC’s CoWoS dominance or risk persistent foundry-client skepticism. Expect TSMC and Samsung to accelerate 2.5D/3D integration, especially around HBM4-AI ASIC co-packaging. Within 18 months, packaging prowess will dictate foundry market share; without leveraging Lee’s SK hynix tenure to fuse memory-logic co-design, Intel Foundry may remain trapped in a ‘process-rich, system-poor’ paradox.