Industry Analysis
SK Hynix’s market cap surpassing Samsung reflects AI infrastructure’s fundamental reshaping of memory hierarchy. Surging HBM3E/HBM4 demand is forcing NVIDIA and TSMC to accelerate CoWoS packaging capacity, indirectly raising the barrier for sub-3nm logic nodes. Samsung, despite its DRAM share lead, lags in TSV stacking yield—risking client defection to SK Hynix. Geopolitically, U.S. CHIPS Act subsidies favor logic over memory, compelling Korean firms to self-fund HBM expansions and heightening leverage risks. Within 12 months, Micron may leverage Japan and Taiwan, China supply chains for a comeback, while Samsung could acquire Hong Kong, China AI startups to close its HBM ecosystem gap. If AI clusters shift toward in-memory computing by 2027, today’s HBM premium may evaporate rapidly.
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