SK Hynix Unveils iHBM to Cut AI Accelerator Heat - 조선일보

SK Hynix unveiled its 'iHBM' technology on May 26, 2026, designed to significantly reduce heat generation in high-bandwidth memory (HBM) used in AI accelerators. As AI computing demands rise, HBM chip... Read original →

SK Hynix’s iHBM isn’t just a thermal tweak—it’s a foundational shift in AI memory stacking. By embedding an Integrated Cooling Element (ICE), it pressures TSV, interposer, and substrate suppliers to rapidly adopt ultra-low thermal resistance materials, especially within 3nm EUV-based CoWoS ecosystems. Amid tightening U.S.-EU export controls on AI accelerators, thermal performance now doubles as a compliance metric: data center energy efficiency regulations could raise certification barriers for customers in Taiwan, China and mainland China. While Samsung pushes liquid-cooled HBM5+, SK Hynix’s compatibility with existing packaging is a calculated blitz to lock in design wins. Within 18 months, the HBM race will pivot from bandwidth to thermal density—making iHBM a de facto standard and forcing NVIDIA and AMD to rearchitect GPU power delivery and floorplanning.